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| MODEL: | |
|---|---|
| Quantity: | |
2510
DLL
replace 2510 wire to board dip connector;molex 2510 wire to board dip connector
| Rated Voltage: | 250V AC,DC |
| Rated current: | 3A AC,DC |
| Contact resistance: | 20MΩ max |
| Insulation Resistance: | 1000MΩ min |
| Withstand Voltage: | 1000V AC/minute |
| Temperature: | -25℃~+85℃ |
| Wire Range: | AWG#28~#22 |
Material:
| Housing: | (Nylon)UL94-V0(2) |
| Terminal: | Phosphor Bronze,Tin Plated |
| Wafer: | (Nylon)UL94-V0(2) |
Drawing:
Our company has powerful research and development ability,we can open mold,develop and produce the products you want!
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Application
The connectors are made of PA66 material, which offers good mechanical strength and durability. This ensures that they can withstand the rigors of repeated insertions and removals, as well as the mechanical forces exerted during device operation. When adding or replacing components, the connectors can endure the necessary handling without getting damaged, thus supporting the long-term expandability and upgradability of the device.
replace molex 2510 22-04-1041 22-04-1051 wire to board dip connector replace molex 2510 22-04-1041 22-04-1051 wire to board dip connector replace molex 2510 22-04-1041 22-04-1051 wire to board dip connector replace molex 2510 22-04-1041 22-04-1051 wire to board dip connector
replace 2510 wire to board dip connector;molex 2510 wire to board dip connector
| Rated Voltage: | 250V AC,DC |
| Rated current: | 3A AC,DC |
| Contact resistance: | 20MΩ max |
| Insulation Resistance: | 1000MΩ min |
| Withstand Voltage: | 1000V AC/minute |
| Temperature: | -25℃~+85℃ |
| Wire Range: | AWG#28~#22 |
Material:
| Housing: | (Nylon)UL94-V0(2) |
| Terminal: | Phosphor Bronze,Tin Plated |
| Wafer: | (Nylon)UL94-V0(2) |
Drawing:
Our company has powerful research and development ability,we can open mold,develop and produce the products you want!
More Products For You To Choose:
Application
The connectors are made of PA66 material, which offers good mechanical strength and durability. This ensures that they can withstand the rigors of repeated insertions and removals, as well as the mechanical forces exerted during device operation. When adding or replacing components, the connectors can endure the necessary handling without getting damaged, thus supporting the long-term expandability and upgradability of the device.
replace molex 2510 22-04-1041 22-04-1051 wire to board dip connector replace molex 2510 22-04-1041 22-04-1051 wire to board dip connector replace molex 2510 22-04-1041 22-04-1051 wire to board dip connector replace molex 2510 22-04-1041 22-04-1051 wire to board dip connector
